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Tianshu HouPh.D., Postdoctoral Researcher |
About
I am currently a postdoctoral research fellow at The Chinese University of Hong Kong (CUHK), supervised by Prof. Bei Yu. I obtained my B.S. degree in Electronic Information Science and Technology at Sichuan University and my Ph.D. degree in Electronic Science and Technology at Shanghai Jiao Tong University. My research integrates physical modeling with artificial intelligence methods to advance the reliability analysis of integrated circuits.
Research Interests
- Electromigration (EM) reliability modeling and prediction
- Reliability-aware modeling for resistive random-access memory (RRAM)
- Multiphysics simulation
- AI-assisted partial differential equation (PDE) solvers
Publications
Conference Papers
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[C6] Tianshu Hou, Yuan Ren, Wenyong Zhou, Can Li, Zhongrui Wang, Hai-Bao Chen, and Ngai Wong, “Physics-Informed Learning for Versatile RRAM Reset and Retention Simulation,” in Proceedings of the 29th Asia and South Pacific Design Automation Conference (ASP-DAC), 2024, pp. 746–751. Available here
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[C5] Zixuan Meng, Xiaoman Yang, Wenjie Zhu, Tianshu Hou, and Hai-Bao Chen, “Fast Electromigration Stress Evolution Analysis Based on Relative Gain Array,” in Proceedings of the 2nd International Symposium of Electronics Design Automation (ISEDA), 2024, pp. 410–415. Available here
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[C4] Wenyong Zhou, Yuan Ren, Jiajun Zhou, Tianshu Hou, and Ngai Wong, “A Time- and Energy-Efficient CNN with Dense Connections on Memristor-Based Chips,” in Proceedings of the 15th IEEE International Conference on ASIC (ASICON), 2023, pp. 1–4. Available here
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[C3] Peining Zhen, Ziyang Gao, Tianshu Hou, Yuan Cheng, and Hai-Bao Chen, “Deeply Tensor Compressed Transformer for End-to-End Object Detection,” in Proceedings of the AAAI Conference on Artificial Intelligence, vol. 36, no. 4, 2022, pp. 4716–4724. Available here
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[C2] Yuan Cheng, Rui Lin, Peining Zhen, Tianshu Hou, Hai-Bao Chen, Hao Yu, and Ngai Wong, “FASSST: Fast Attention Based Single-Stage Segmentation Net for Real-Time Instance Segmentation,” in Proceedings of the IEEE/CVF Winter Conference on Applications of Computer Vision (WACV), 2022, pp. 2210–2218. Available here
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[C1] Zai Liu, Hai-Bao Chen, and Tianshu Hou, “Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires,” in Proceedings of the IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 2020, pp. 62–65. Available here
Journal Papers
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[J7] Tianshu Hou, Farid N. Najm, Ngai Wong, and Hai-Bao Chen, “Novel partitioning-based approach for electromigration assessment with neural networks,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, pp. 1–14, accepted April 24, 2025. Available here
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[J6] Xiaoman Yang, Hai-Bao Chen, Yuhan Zhang, Tianshu Hou, Pengpeng Ren, Runsheng Wang, Zhigang Ji and Ru Huang, “Physics-informed learning based multiphysics simulation for fast transient TSV electromigration analysis,” ACM Transactions on Design Automation of Electronic Systems, vol. 30, no.18 ,pp. 1–22, 2025. Available here
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[J5] Tianshu Hou, Ngai Wong, Quan Chen, Zhigang Ji, and Hai-Bao Chen, “Analytical postvoiding modeling and efficient characterization of EM failure effects under time-dependent current stressing,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 42, no. 12, pp. 4959–4972, 2023. Available here
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[J4] Tianshu Hou, Peining Zhen, Zhigang Ji, and Hai-Bao Chen, “A deep learning framework for solving stress-based partial differential equations in electromigration analysis,” ACM Transactions on Design Automation of Electronic Systems, vol. 28, no. 4, pp. 1–20, 2023. Available here
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[J3] Peining Zhen, Xiaotao Yan, Wei Wang, Tianshu Hou, Hao Wei, and Hai-Bao Chen, “Towards Compact Transformers for End-to-End Object Detection with Decomposed Chain Tensor Structure,” IEEE Transactions on Circuits and Systems for Video Technology, vol. 33, no. 2, pp. 872–885, 2023. Available here
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[J2] Tianshu Hou, Peining Zhen, Ngai Wong, Quan Chen, Guoyong Shi, Shuqi Wang, and Hai-Bao Chen, “Multilayer perceptron-based stress evolution analysis under DC current stressing for multisegment wires,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 42, no. 2, pp. 544–557, 2022. Available here
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[J1] Tianshu Hou, Ngai Wong, Quan Chen, Zhigang Ji, and Hai-Bao Chen, “A space–time neural network for analysis of stress evolution under DC current stressing,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 41, no. 12, pp. 5501–5514, 2022. Available here
Education
- Ph.D. in Electronic Science and Technology, Shanghai Jiao Tong University, China, 2025
- B.S. in Electronic Information Science and Technology, Sichuan University, China, 2019
Experience
- Visiting Scholar, University of Toronto, Canada, 2024
- Visiting Scholar, The University of Hong Kong, 2023
- Invited Speaker, Overview of Electromigration Assessment, Intel Programmable Solutions Group (PSG), Toronto, 2024
Academic Service
- Reviewer, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD)
- Reviewer, IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS)
Honors and Awards
- CSC Scholarship, China Scholarship Council, 2023
- National Scholarship for Doctoral Students, Ministry of Education of China, 2022
Contact
I'm always open to collaboration opportunities and exchanging ideas. If you're working on related topics, feel free to reach out!